NanoAce 300 & NanoAce 200

For large area substrates and high performance tolerance requirements.

The NanoAce 200 and NanoAce 300 are 8” and 12” semi-automatic wafer saws with a dual track positioning system for demanding cutting tolerance applications. It offers a high level of configurability to get the best performance out of your application.

Applications Silicon wafers, silicon wafer composites, Glass, MEMs structures, Ceramics, Photonics
Work Area   NanoAce 200 NanoAce 300
H 20mm 20mm
L 260mm 310mm
W 260mm 310mm
Blade 2”,3”
50-76mm
Chuck-type Ceramic or metal vacuum, tapeless jig, mechanical vice, magnetic vice
Spindle 1.2kw 0...60krpm
or 2.4kw 0...60krpm
Features Bespoke software configurations, spindle load monitoring, kerf-check functionality, blade breakage detection, cutting, grinding and profiling modes, wafer reduction and trimming, blade wear monitoring and correction, automatic blade dressing, programmable user alerts & alarms

Download NanoAce200 brochure

Download NanoAce300 brochure


NanoAce 450

For very large area substrates or for high-throughput requirements found in the electronic components industry. High performance tolerance requirements.

The NanoAce 450 is a unique and versatile semi-automatic wafer saw that can be used for advanced component singulation applications and then easily changed over for regular 6”, 8” or 12” applications within a matter of minutes. Like its smaller area NanoAce 300 equivalent, it ultilises a dual track positioning system for demanding cutting tolerance applications.

Applications FR4 boards, cutting of multiple ceramic plate arrays for high-throughput
Work Area H With Ɵ / theta table 13mm Without Ɵ / theta table 13mm
L 305mm 450mm / 18”
W 305mm 300mm / 12”
Blade 2”,3”
50,76mm
Chuck-type Ceramic or metal vacuum, tapeless jig, mechanical vice, magnetic vice
Spindle 1.2kw 0...60krpm
or 2.4kw 0...60krpm
Features Bespoke software configurations, spindle load monitoring, kerf-check functionality, blade breakage detection, cutting, grinding and profiling modes, wafer reduction and trimming, blade wear monitoring and correction, automatic blade dressing, programmable user alerts & alarms

Download NanoAce450 brochure

The performance all NanoAces is underpinned by the Loadpoint NanoControl control system; a common control platform used across all our machines. NanoControl uses a Loadpoint developed force-sensitive keypad with integrated tracker ball that provides a highly productive interface that is also robust for many years of service.

Another feature of NanoControl is that it can be developed bespoke to a customer’s application. This could involve taking the manual hassle out of calculating complex cut patterns or could involve easy generation of 3D cutting profiles.

Download NanoControl brochure